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Rosin-based solder paste containing a medium-active flux. The paste facilitates soldering components containing copper, silver, zinc, and nickel. It is also used for tin plating and soldering in electronic device assembly, as well as in radio and communications technology.
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Rosin-based solder paste containing a medium-active flux. The paste facilitates soldering components containing copper, silver, zinc, and nickel. It is also used for tin plating and soldering in electronic device assembly, as well as in radio and communications technology.
Appearance: paste
Density: 80°C ~0.95 g/cm3
Color: amber
Operating temperature: 50-200°C
Solubility in water: does not dissolve
Manufacturer: AG TermoPasty
Weight: 20g
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Rosin-based solder paste containing a medium-active flux. The paste facilitates soldering components containing copper, silver, zinc, and nickel. It is also used for tin plating and soldering in electronic device assembly, as well as in radio and communications technology.